PRODUCT
Powerful removing capabilities Jet Scrubber's abrasive grains!
High Pressure Rinse Modules
MACHINERY
These machines spray high-pressure jets of water at the board to remove burrs and waste residues from the inside of the circuit board holes.
High pressure rinse modules is excellent in removing burrs generated from drilling in the treatment for plating process and abrasive used in Jet Scrubbing process in the treatment for D/F and Solder Resist.
| Work Size (W x L) | 220 x 220 to 700 x 700 mm |
| Board Thickness | 0.084 - 3.2 mm |
| Effective Processing Width | 700mm |
Applications/Features
- These units can be manufactured to respond to non-standard requirements.